Company Fair & Sponsorship

The 14th International Conference on PhD Research in Microelectronics and Electronics (PRIME 2018) and the 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD 2018) will be co-Chaired, co-held from 2nd to 5th of July 2018 and co-located at the Faculty of Nuclear Sciences and Physical Engineering, Czech Technical University in Prague, Czech Republic.

A company fair will be organized to allow academia researchers and Ph.D. students, attending to both conferences (PRIME 2018 and SMACD 2018) in the areas of IC Design and Electronic Design Automation, to get in contact with industries and other research institutions (and vice-versa) to promote networking and identify future opportunities and collaborations.

To get more Information

Email: info@prime2018.org

Sponsorship

  • Conference Gold Sponsor
    In addition to the benefits of a Silver Sponsor, the company name and patronage level in press communications and on all conference materials, acknowledgement by the General Chair during all social events and the presence during the Opening, Closing and Awards Ceremony.
  • Conference Silver Sponsor
    In addition to the benefits of a Bronze Sponsor, your company presentation will be included in the Final Program (one page) and acknowledged by the General Chair during social events.
  • Conference Bronze Sponsor
    You will have Standard Booth - Option II package (including registration for 2 people), your company logo on the conference website and conference materials, and a paragraph about the company/organization on the website of the conference.

Company Fair Booths

  • Company Fair Standard Booth - Option I
    You will have a table, chair and one full registration to interact with the Conference delegates.
  • Company Fair Standard Booth - Option II
    You will have a table, chair and two full registrations to interact with the Conference delegates.